Analysis of bimaterial interface cracks using the localized method of fundamental solutions
Author:
Publisher
Elsevier BV
Subject
Applied Mathematics
Reference19 articles.
1. Elastic crack growth in finite elements with minimal remeshing;Belytschko;Internat J Numer Methods Engrg,1999
2. Comparison of several BEM-based approaches in evaluating crack-tip field intensity factors in piezoelectric materials;Lei;Int J Fract,2014
3. Fracture analysis of ultra-thin coating/substrate structures with interface cracks;Gu;Int J Solids Struct,2021
4. Fracture mechanics analysis of two-dimensional cracked thin structures (from micro- to nano-scales) by an efficient boundary element analysis;Gu;Results Appl. Math.,2021
5. Simulating backward wave propagation in metamaterial with radial basis functions;Li;Results Appl. Math.,2019
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Instantaneous thermal fracture behaviors of a bimaterial with a penny-shaped interface crack via generalized fractional heat transfer;Applied Mathematical Modelling;2024-08
2. A generalized finite difference method for 2D dynamic crack analysis;Results in Applied Mathematics;2024-02
3. Simulation of mode II fracture propagation in adhesive joints using a meshless technique;Composites Part C: Open Access;2023-10
4. Acoustic Emission in a Bimaterial with an Internal Crack;2023 IEEE XXVIII International Seminar/Workshop on Direct and Inverse Problems of Electromagnetic and Acoustic Wave Theory (DIPED);2023-09-11
5. The localized method of fundamental solutions for 2D and 3D second-order nonlinear boundary value problems;Engineering Analysis with Boundary Elements;2022-06
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3