Influence of titanium oxide films on copper nucleation during electrodeposition-Reference-Cited by-同舟云学术

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Influence of titanium oxide films on copper nucleation during electrodeposition

Published:2005-11 Issue:1-2 Volume:409 Page:317-328
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Chang Hyun K.,Choe Byung-Hak,Lee Jong K.

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference26 articles.

1. Modern Electorplating;Schlesinger,2000

2. Spontaneous growth mechanism of tin whiskers

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