Electrically assisted diffusion bonding of Ti2AlNb alloy sheet using CP-Ti foil interlayer: Microstructural characterization and mechanical tests
Author:
Funder
National Natural Science Foundation of China
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
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5. Part III. The tensile behavior of Ti-Al-Nb O+Bcc orthorhombic alloys;Boehlert;Metall. Mater. Trans.: A,2001
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