Effect of cooling rate during solidification of Sn–9Zn lead-free solder alloy on its microstructure, tensile strength and ductile–brittle transition temperature-Reference-Cited by-同舟云学术

Effect of cooling rate during solidification of Sn–9Zn lead-free solder alloy on its microstructure, tensile strength and ductile–brittle transition temperature

Published:2012-01 Issue: Volume:533 Page:64-70
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Prabhu K.N.,Deshapande Parashuram,Satyanarayan

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference14 articles.

1. Investigations on microhardness of Sn–Zn based lead-free solder alloys as replacement of Sn–Pb solder

2. Impression creep of hypoeutectic Sn–Zn lead-free solder alloys

3. Effects of cooling rate on creep behavior of a Sn-3.5Ag alloy

4. The effects of cooling rate on microstructure and mechanical behavior of Sn-3.5Ag solder

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