The role of copper twin boundaries in cryogenic indentation-induced grain growth-Reference-Cited by-同舟云学术

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The role of copper twin boundaries in cryogenic indentation-induced grain growth

Published:2014-01 Issue: Volume:592 Page:182-188
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Brons J.G.,Hardwick J.A.,Padilla H.A.,Hattar K.,Thompson G.B.,Boyce B.L.

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference46 articles.

1. Grain coarsening during compression of bulk nanocrystalline nickel and copper

2. In Situ Observation of Recovery and Grain Growth in High Purity Aluminum

3. Secondary recrystallization effects in nanostructured elemental metals

4. Grain rotation in thin films of gold

5. Kinetic Instability of Nanocrystalline Aluminum Prepared by Chemical Synthesis; Facile Room-Temperature Grain Growth

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