Fluxless wafer bonding with Sn-rich Sn–Au dual-layer structure-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Fluxless wafer bonding with Sn-rich Sn–Au dual-layer structure

Published:2006-02 Issue:1-2 Volume:417 Page:143-148
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Kim Jongsung,Lee Chin C.

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference15 articles.

1. Wafer bonding technology and its applications in optoelectronic devices and materials

2. Wafer-to-wafer bonding for microstructure formation

3. Silicon‐On‐Insulator by Wafer Bonding: A Review

4. Low-temperature silicon wafer-to-wafer bonding using gold at eutectic temperature

5. Low-temperature intermediate Au-Si wafer bonding; eutectic or silicide bond

Cited by 26 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Phase Engineering of Epitaxial Stanene on a Surface Alloy;The Journal of Physical Chemistry Letters;2020-12-16

2. Characteristics of eutectic and near-eutectic Zn–Al alloys as high-temperature lead-free solders;Journal of Materials Science: Materials in Electronics;2019-12-14

3. High-Temperature Lead-free Solder Materials and Applications;Harsh Environment Electronics;2019-03-29

4. Electroplating of 3D Sn-rich solder for MEMS packaging applications;Journal of Micromechanics and Microengineering;2019-02-28

5. An electrical test method for quality detecting of wafer level eutectic bonding;Journal of Micromechanics and Microengineering;2016-11-30

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP