Enhanced tensile ductility and strength of electrodeposited ultrafine-grained nickel with a desired bimodal microstructure-Reference-Cited by-同舟云学术

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Enhanced tensile ductility and strength of electrodeposited ultrafine-grained nickel with a desired bimodal microstructure

Published:2017-07 Issue: Volume:701 Page:196-202
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Zhang Qian,Liu Ying,Liu Yongsheng,Ren Yanhong,Wu Yanxia,Gao Zhipeng,Wu Xiaolei,Han Peide

Funder

National Natural Science Foundation of China

National Natural Science Foundation of Shanxi Province

Research Fund for the Doctoral Program of Higher Education of China

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference31 articles.

1. Strengthening materials by engineering coherent internal boundaries at the nanoscale;Lu;Science,2009

2. Deformation mechanisms in nanotwinned metal nanopillars;Jang;Nat. Nanotechnol.,2012

3. High tensile ductility in a nanostructured metal;Wang;Nature,2002

4. Ultrahigh strength and high electrical conductivity in copper;Lu;Science,2004

5. Ultrahigh strength and high ductility of bulk nanocrystalline copper;Youssef;Appl. Phys. Lett.,2005

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