Funder
National Natural Science Foundation of China
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference41 articles.
1. History IGBT. State-of-the-art, and future prospects;Iwamuro;IEEE Trans. Electron. Dev.,2017
2. The role of power device technology in the electric vehicle powertrain;Robles;Int. J. Energy Res.,2022
3. A review of SiC power module packaging technologies: challenges, advances, and emerging issues;Lee;IEEE J. Emerg. Sel. Top. Power Electro.,2020
4. Failure mechanisms of direct copper bonding substrates (DCB), Electron. System;Günther;Integration Tech. Conf.,2006
5. Thermal fatigue of Ag flake sintering die-attachment for Si/SiC power devices;Sakamoto;J. Mater. Sci. Mater. Electron.,2013
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