Annealing effect on residual stress of Sn-3.0Ag-0.5Cu solder measured by nanoindentation and constitutive experiments-Reference-Cited by-同舟云学术

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Annealing effect on residual stress of Sn-3.0Ag-0.5Cu solder measured by nanoindentation and constitutive experiments

Published:2017-06 Issue: Volume:696 Page:90-95
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Long Xu,Wang Shaobin,Feng Yihui,Yao Yao,Keer Leon M.

Funder

National Natural Science Foundation of China

Fundamental Research Funds for the Central Universities

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference30 articles.

1. European Union, Off. J. Eur. Union, L37, 2003, pp. 19–23.

2. Effects of temperature and strain rate on the mechanical properties of lead-free solders

3. Strain Rate Effects and Rate-Dependent Constitutive Models of Lead-Based and Lead-Free Solders

4. A new unified constitutive model with short- and long-range back stress for lead-free solders of Sn–3Ag–0.5Cu and Sn–0.7Cu

5. Effects of cooling speed on microstructure and tensile properties of Sn–Ag–Cu alloys

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