Intrinsic properties and strengthening mechanism of monocrystalline Ni-containing ternary concentrated solid solutions
Author:
Funder
U.S. Department of Energy
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference37 articles.
1. Microstructural development in equiatomic multicomponent alloys;Cantor;Mater. Sci. Eng. A,2004
2. Mechanical properties of Nb25Mo25Ta25W25 and V20Nb20Mo20Ta20W20 refractory high entropy alloys;Senkov;Intermetallics,2011
3. Absence of long-range chemical ordering in equimolar FeCoCrNi;Lucas;Appl. Phys. Lett.,2012
4. Designing high entropy alloys employing thermodynamics and Gaussian process statistical analysis;Tancret;Mater. Des.,2017
5. A fracture-resistant high-entropy alloy for cryogenic applications;Gludovatz;Science,2014
Cited by 49 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. High-Entropy Materials Design by Integrating the First-Principles Calculations and Machine Learning: A Case Study in the Al-Co-Cr-Fe-Ni System;High Entropy Alloys & Materials;2024-07-04
2. Advanced mechanical properties obtained via transition metals doped in CrFeNi medium entropy alloy;Journal of Materials Research and Technology;2024-05
3. Effect of grain orientation and precipitates on the superelasticity of Fe–Ni–Co–Al polycrystalline alloys;Materials Science and Engineering: A;2024-01
4. Enhancing strength and ductility of CrCoNi medium-entropy alloy through the 9R phase and doping;Materials Chemistry and Physics;2024-01
5. Enhanced irradiation tolerance of a medium entropy alloy via precipitation and dissolution of nanoprecipitates;Journal of Nuclear Materials;2023-12
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3