Evolution of microstructure and properties of an ultrahigh strength Cu–Ni–Sn alloy with low Sn content during the multi-stage thermomechanical treatment-Reference-Cited by-同舟云学术

Evolution of microstructure and properties of an ultrahigh strength Cu–Ni–Sn alloy with low Sn content during the multi-stage thermomechanical treatment

Published:2023-05 Issue: Volume:872 Page:144933
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Zhang Yufang,Gan Xueping,Xiao Zhu,Jia Yanlin^ORCID,Qiu Wenting,Meng Xiangpeng,Zhang Yi,Xiao Lairong,Sun Gai,Zhang Tianyi

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference48 articles.

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3. Effect of Sm doping on the microstructure, mechanical properties and shape memory effect of Cu-13.0 Al-4.0 Ni alloy;Zhang;Materials,2021

4. A new ultrahigh strength Cu–Ni–Si alloy;Lei;Intermetallics,2013

5. A novel Cu–Ni–Zn–Al alloy with high strength through precipitation hardening;Zhou;Mater. Sci. Eng., A,2010

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