The effect of Cu addition and solution heat treatment on the microstructure, hardness and tensile properties of Al–15%Mg2Si–0.15%Li composite
Author:
Funder
University of Tehran
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference43 articles.
1. Study on tool wear and surface roughness in machining of particulate aluminum metal matrix composite-response surface methodology approach
2. An Introduction to Metal Matrix Composites;Clyne,1993
3. On the fracture toughness of particulate reinforced metal-matrix composites
4. Fracture mechanism in a SiCw-6061 Al composite
5. Cyclic strain resistance and fracture behaviour of Al2O3-particulate-reinforced 2014 aluminium alloy metal-matrix composites
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