Growth behavior of compound layers during reactive diffusion between solid Cu and liquid Al-Reference-Cited by-同舟云学术

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Growth behavior of compound layers during reactive diffusion between solid Cu and liquid Al

Published:2007-02 Issue: Volume:445-446 Page:355-363
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Tanaka Y.,Kajihara M.,Watanabe Y.

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference44 articles.

1. A study of the interdiffusion of aluminum and zirconium

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