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2. K. Gilleo, Area Array Packaging Handbook, McGraw-Hill, New York, 2002, p. 4.1.
3. J.H. Lau, Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies, McGraw-Hill, New York, 2000, pp. 1–17.
4. J.H. Lau, in: J.H. Lau (Ed.), Flip Chip Technologies, McGraw-Hill, New York, 1995, pp. 25–59.
5. J.H. Lau, Y.H. Pao, Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies, McGraw-Hill, New York, 1997, pp. 1–9.