A bulk of uniform nanocrystalline copper with superior comprehensive mechanical properties electroformed in an ultra-low sulfate concentration bath without additives-Reference-Cited by-同舟云学术

A bulk of uniform nanocrystalline copper with superior comprehensive mechanical properties electroformed in an ultra-low sulfate concentration bath without additives

Published:2017-09 Issue: Volume:704 Page:238-245
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Shen C.J.,Zhu Z.W.,Zhu D.

Funder

National Natural Science Foundation of China

Jiangsu Key Laboratory of Precision and Micro-Manufacturing Technology

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference42 articles.

1. Mechanical properties of micro-sized copper bending beams machined by the focused ion beam technique;Motz;Acta Mater.,2005

2. Approach of copper losses determination in planar windings;Abderahim;Electron. Lett.,2016

3. CMOS-NEMS copper switches monolithically integrated using a 65 nm CMOS technology;Muñoz-Gamarra;Micromachines-basel,2016

4. Friction characteristics of CFRP plates in contact with copper plates under high contact pressure;Mohee;J. Compos. Constr.,2016

5. LHP heat transfer performance: a comparison study about sintered copper powder wick and copper mesh wick;Wang;Appl. Therm. Eng.,2016

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