Evaluation of interface structure and high-temperature tensile behavior in Cu/Al8011/Al5052 trilayered composite-Reference-Cited by-同舟云学术

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Evaluation of interface structure and high-temperature tensile behavior in Cu/Al8011/Al5052 trilayered composite

Published:2020-11 Issue: Volume:798 Page:140129
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Ebrahimi Mahmoud,Liu Guoping,Wang Qudong,Jiang Haiyan,Ding Wenjiang,Shang Zhengping,Luo Liugen

Funder

National Natural Science Foundation of China

111 Project

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference36 articles.

1. Overview of the recycling technology for copper-containing cables;Li;Resour. Conserv. Recycl.,2017

2. Electrical biasing substrate integrated waveguide tunable band-pass filter with liquid crystal technology;Li;Optik (Stuttg),2017

3. Design and characterization of millimeter-wave micromachined polymer-based cavity filter with resonant cylinders;Xiao;Sensors Actuators, A Phys.,2018

4. Comparison of copper electroplating, copper wet etching and linear sweep voltammetry as techniques to investigate the porosity of atomic layer deposited Al2O3;Vanhaverbeke;Thin Solid Films,2019

5. Copper electroplating of 3D printed composite electrodes;Vaněčková;J. Electroanal. Chem.,2020

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1. Shear behavior of Cu/Al/Cu trilayered composites prepared by high-temperature oxygen-free rolling;Journal of Alloys and Compounds;2024-11

2. Enhanced Multifaceted Properties of Nanoscale Metallic Multilayer Composites;Materials;2024-08-12

3. Electropulsing-enhanced atomic diffusion and recrystallization to optimize mechanical properties of Al/Cu laminated metal composites;Journal of Manufacturing Processes;2024-06

4. A Study on the Microstructural Evolution, Interfacial Diffusion and Mechanical Properties of Ultra-thin Stainless Steel–Copper Composites Fabricated by Roll Bonding;Metals and Materials International;2024-05-04

5. Effect of solid solution and vacancies on the mechanical properties of Cu(Al)/Al2Cu/(Cu)Al layered gradient heterostructures;Physica B: Condensed Matter;2024-05

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