Characterization of tensile behavior of a two-dimensional woven carbon/silicon carbide composite fabricated by chemical vapor infiltration
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference29 articles.
1. C/C–SiC composites for space applications and advanced friction systems
2. Advanced ceramic matrix composite materials for current and future propulsion technology applications
3. A probabilistic-statistical approach to the ultimate failure of ceramic-matrix composites—part I: experimental investigation of 2D woven SiC/SiC composites
4. Damage characterization of a 2D SiCSiC composite material
5. Characterization of microstructure and tensile behavior of a cross-woven CSiC composite
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1. Hysteresis constitutive model of C/SiC composites considering probabilistic matrix fragmentations;Journal of the American Ceramic Society;2024-08-21
2. Cross-scale static/dynamic shear damage evolution mechanism of 2D C/SiC ceramic matrix composite with transient hysteresis effect;Ceramics International;2024-05
3. Influence of interphase type and thickness on the interface properties and tensile damage evolution of C/SiC composites;Proceedings of the Institution of Mechanical Engineers, Part L: Journal of Materials: Design and Applications;2024-02-28
4. Characterization of multi-step cyclic-fatigue hysteresis behavior of 2D SiC/SiC composite using inverse tangent modulus;Ceramics International;2024-02
5. The performance transition of C/SiC composites induced by redistribution of residual stress;Carbon;2024-02
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