Environmental influence on interface interactions and adhesion of Au/SiO2
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference13 articles.
1. Reliability and Failure Mechanisms of Electronic Materials
2. Thermal fatigue testing of thin metal films
3. An experimental study of the mechanisms of crack extension along an oxide/metal interface
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