Flow stress and microstructures of fine grained copper-Reference-Cited by-同舟云学术

Flow stress and microstructures of fine grained copper

Published:2004-12 Issue: Volume:387-389 Page:186-190
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Huang X.,Hansen N.

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference15 articles.

1. The plastic deformation of polycrystalline aggregates

2. The effect of grain size and strain on the tensile flow stress of aluminium at room temperature

3. The strain and grain size dependence of the flow stress of copper

4. The effect of grain size and strain on the tensile flow stress of quenched aluminum

5. N. Hansen, in: T.N. Baker (Ed.), Yield, Flow and Fracture of Polycrystals, Elsevier Applied Science Publishers, London, England, 1983, pp. 311–350.

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