Effects of coupled stressing and solid-state aging on the mechanical properties of graphene nanosheets reinforced Sn–58Bi–0.7Zn solder joint
Author:
Funder
National Natural Science Foundation of China
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference22 articles.
1. Electromigration Behaviors and Effects of Addition Elements on the Formation of a Bi-rich Layer in Sn58Bi-Based Solders
2. Joule heating effect on oxide whisker growth induced by current stressing in Cu/Sn-58Bi/Cu solder joint
3. Effects of Electromigration on the Creep and Thermal Fatigue Behavior of Sn58Bi Solder Joints
4. In situ observations on shear and creep–fatigue fracture behaviors of SnBi/Cu solder joints
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1. Microstructure and mechanical behavior of Graphene NanoSheets enhanced lead-free Sn–0.3Ag–0.7Cu solder;Journal of Materials Science: Materials in Electronics;2024-07
2. Polarity effect of interfacial intermetallic compounds of BGA structure Cu/Sn–52In/Cu solder joints during electromigration;Intermetallics;2024-05
3. The grain refinements effect of Zn alloying on low-temperature Sn–Bi–In lead-free solder;Journal of Materials Research and Technology;2024-03
4. Melting Characteristic, Wettability, Interfacial Reaction, and Shear Property of Ball Grid Array Structure Cu/Sn0.3Ag0.7Cu/Cu Solder Joints With Ni-Modified Carbon Nanotubes;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-08
5. Effect of electric current stressing on mechanical performance of solders and solder joints: A review;Journal of Materials Science;2022-09-28
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