Microstructural evolution and growth kinetics of interfacial compounds in TiAl/Ti3SiC2 diffusion bonding joints-Reference-Cited by-同舟云学术

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Microstructural evolution and growth kinetics of interfacial compounds in TiAl/Ti3SiC2 diffusion bonding joints

Published:2019-05 Issue: Volume:756 Page:149-155
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Wang Qi,Chen Guo-qing,Wang Kang,Fu Xue-song,Zhou Wen-long

Funder

National Natural Science Foundation of China

Central Universities

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference49 articles.

1. The MN+1AXN phases: a new class of solids;Barsoum;Prog. Solid State Chem.,2000

2. The morphology of oxides and oxidation behavior of Ti3SiC2-based composite at high-temperature;Li;Compos. Sci. Technol.,2003

3. Synthesis and characterization of a remarkable ceramic: Ti3SiC2;Barsoum;J. Am. Ceram. Soc.,1996

4. Solid combustion synthesis of Ti3SiC2;Pampuch;J. Eur. Ceram. Soc.,1989

5. Progress in research and development on MAX phases: a family of layered ternary compounds;Sun;Int. Mater. Rev.,2011

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