Strength optimization of low-pressure transient liquid phase bonded Ti–6Al–4V similar joint with Cu–Ni multi-interlayer
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference21 articles.
1. An overview on the use of titanium in the aerospace industry;Boyer;Mater. Sci. Eng. A.,1996
2. Machinability improvement of titanium alloy (Ti-6Al-4V) via LAM and hybrid machining;Dandekar;Int. J. Mach. Tool Manufact.,2010
3. Electron beam welding - techniques and trends - Review;Wȩglowski;Vacuum,2016
4. Microstructure evolution and fracture behaviour for electron beam welding of Ti-6Al-4V;Wu;Bull. Mater. Sci.,2004
5. Friction stir welding and processing;Mishra;Mater. Sci. Eng. R Rep.,2005
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Dissimilar transient liquid phase bonding of Ti-6Al-4V alloy to Inconel 625 superalloy: effect of bonding temperature on microstructural evolutions and mechanical properties;Welding in the World;2024-04-30
2. Influence of Nickel Content on the Formation of an Interaction Zone during Contact Melting of Titanium with Copper-Nickel Alloys;Metals;2024-03-01
3. Inducing low-temperature melting of TiNiCuNb eutectic alloy for manufacturing strong C/C-SiC composite joints;Materials Characterization;2024-01
4. Effect of Nb interlayer on residual and bending stress relaxation in Si<sub>3</sub>N<sub>4</sub>/Nb/Ti-6Al-4V joints;Transactions of the JSME (in Japanese);2024
5. Dissimilar transient liquid phase bonding of Ti-6Al-4V alloy to Inconel 625 superalloy: Effect of bonding temperature on microstructural evolutions and mechanical properties;2023-12-12
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3