Thermal behavior of copper processed by ECAP with and without back pressure-Reference-Cited by-同舟云学术

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Thermal behavior of copper processed by ECAP with and without back pressure

Published:2015-03 Issue: Volume:628 Page:21-29
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Wang Ya Li,Lapovok Rimma,Wang Jing Tao,Qi Yuan Shen,Estrin Yuri

Funder

MOST of China

Key project of Chinese Ministry of Education

China Scholarship Council

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference50 articles.

1. V.M. Segal, W. Yi, S. Ferrasse, C. Tse Wu, S. D. Strothers, F.A. Alford, W.B. Willett, US Patents no. 7767043 B2, 2010.

2. Scale up and application of equal-channel angular extrusion for the electronics and aerospace industries

3. Extreme grain refinement by severe plastic deformation: A wealth of challenging science

4. On the room-temperature grain growth in nanocrystalline copper

5. Stored energy, vacancies and thermal stability of ultra-fine grained copper

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