Micromechanism fabrication using silicon fusion bonding

Author:

Liu Zhixiong,DeVoe Don L.

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Computer Science Applications,General Mathematics,Software,Control and Systems Engineering

Reference15 articles.

1. Van Drieenhuizen BP, Maluf NI. High resolution single crystal silicon accelerometer using silicon fusion bonding and deep reactive ion etching. Proceedings of the ASME IMECE. 1997. p. 9–12.

2. Petersen K, Barth P, Poydock J, Brown J, Mallon jr. J, Bryzek J. Silicon fusion bonding for pressure sensors. Proceedings of the Solid State Sensor and Actuator Workshop (Hilton Head 88). 1988. p. 144–7.

3. Lin C-C, Ghodssi R, Ayon AA, Chen D-Z, Schmidt MA. Fabrication and characterization of a micro turbine/bearing rig. Proceedings of the IEEE International MEMS 99 Conference. 1999. p. 529–33.

4. Kimball C, Tsai LW, DeVoe D, Maloney J. Modeling and batch fabrication of spatial micro-manipulators. Proceedings of the ASME DETC. July 2000.

5. Schmidt MA. Wafer-to-wafer bonding for microstructure formation. Proceedings of the IEEE. Vol. 6, 1998. p. 1575–85.

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