Quantifying the influence of microstructure on effective conductivity and permeability: Virtual materials testing
Author:
Publisher
Elsevier BV
Subject
Applied Mathematics,Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science,Modeling and Simulation
Reference40 articles.
1. Cross-property correlations and permeability estimation in sandstone;Arns;Phys. Rev. E,2005
2. Prediction of diffusive transport through polymer films from characteristics of the pore geometry;Barman;AlChE J.,2019
3. Stochastic Geometry and its Applications;Chiu,2013
4. Impact of microstructure on local carrier lifetime in Perovskite solar cells;DeQuilettes;Science,2015
5. Quantitative relationships between microstructure and effective transport properties based on virtual materials testing;Gaiselmann;AlChE J.,2014
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