Multi-level modeling of woven glass/epoxy composite for multilayer printed circuit board applications-Reference-Cited by-同舟云学术

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Multi-level modeling of woven glass/epoxy composite for multilayer printed circuit board applications

Published:2014-10 Issue:21-22 Volume:51 Page:3679-3688
ISSN:0020-7683
Container-title:International Journal of Solids and Structures
language:en
Short-container-title:International Journal of Solids and Structures

Author:

Chen Zhuo,Yang Fan,Meguid S.A.

Publisher

Elsevier BV

Subject

Applied Mathematics,Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science,Modeling and Simulation

Reference26 articles.

1. Modeling damage in a plain weave fabric-reinforced composite material;Blackketter;J. Compos. Technol. Res.,1993

2. Solutions for effective shear properties in three phase sphere and cylinder models;Christensen;J. Mech. Phys. Solids,1979

3. Continuum Mechanics of Anisotropic Materials;Cowin,2013

4. Three-dimensional modeling of woven-fabric composites for effective thermo-mechanical and thermal properties;Dasgupta;Compos. Sci. Technol.,1996

5. Harris’s Shock and Vibration Handbook;Harris,2002

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