Transient thermal shock fracture analysis of functionally graded piezoelectric materials by the extended finite element method-Reference-Cited by-同舟云学术

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Transient thermal shock fracture analysis of functionally graded piezoelectric materials by the extended finite element method

Published:2014-06 Issue:11-12 Volume:51 Page:2167-2182
ISSN:0020-7683
Container-title:International Journal of Solids and Structures
language:en
Short-container-title:International Journal of Solids and Structures

Author:

Liu Peng,Yu Tiantang,Bui Tinh Quoc,Zhang Chuanzeng,Xu Yepeng,Lim Chee Wah

Funder

German Research Foundation

German Academic Exchange Service

National Natural Science Foundation of China

Fundamental Research Funds for the Central Universities

Publisher

Elsevier BV

Subject

Applied Mathematics,Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science,Modelling and Simulation

Reference47 articles.

1. Application of the X-FEM to the fracture of piezoelectric materials;Béchet;Int. J. Numer. Methods Eng.,2009

2. Elastic crack growth in finite elements with minimal remeshing;Belytschko;Int. J. Numer. Methods Eng.,1999

3. Dynamic crack propagation based on loss of hyperbolicity and a new discontinuous enrichment;Belytschko;Int. J. Numer. Methods Eng.,2003

4. A study of finite size effects on cracked 2-D piezoelectric media using extended finite element method;Bhargava;Comput. Mater. Sci.,2011

5. X-FEM simulation for two-unequal-collinear cracks in 2-D finite piezoelectric specimen;Bhargava;Int. J. Mech. Mater. Des.,2012

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