Analytical study of electromechanical buckling of a micro spherical elastic film on a compliant substrate part I: Formulation and linear buckling of periodic patterns-Reference-Cited by-同舟云学术

Analytical study of electromechanical buckling of a micro spherical elastic film on a compliant substrate part I: Formulation and linear buckling of periodic patterns

Published:2017-03 Issue: Volume:109 Page:180-188
ISSN:0020-7683
Container-title:International Journal of Solids and Structures
language:en
Short-container-title:International Journal of Solids and Structures

Author:

Abu-Salih Samy

Publisher

Elsevier BV

Subject

Applied Mathematics,Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science,Modeling and Simulation

Reference42 articles.

1. Analysis of thermo electromechanical buckling of micro annular plate;Abu-Salih;J. Comput. Theor. Nanosci.,2014

2. Analytical study of electromechanical buckling of a micro spherical elastic film on a compliant substrate Part II: postbuckling analysis;Abu-Salih;Int. J. Solids Struct.,2016

3. Analytic postbuckling solution of a pre-stressed infinite beam bonded to a linear elastic foundation;Abu-Salih;Int. J. Solids Struct.,2005

4. Experimental validation of electromechanical buckling;Abu-Salih;J. Microelectromech. Syst.,2006

5. Buckling of a stiff film bound to a compliant substrate – Part I: formulation, linear stability of cylindrical patterns, secondary bifurcations;Audoly;J. Mech. Phys. Solids,2008

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