Polymer/layered silicate nanocomposites as high performance ablative materials
Author:
Publisher
Elsevier BV
Subject
Geochemistry and Petrology,Geology
Reference43 articles.
1. Primary thermal decomposition process of aliphatic polyamides;Ballistreri;Polym. Degrad. Stab.,1988
2. Investigation of the kinetics of thermal degradation of commodity plastics;Bockhorn;Combust. Sci. Technol.,1996
3. Synthesis and characterization of siloxane nanocomposites;Burnside;Chem. Mater.,1995
4. A microstructural study of the improved ablation resistance of carbon phenolic composites fabricates using H3PO4 coated carbon fibres;Cho;J. Mater. Sci. Lett.,1996
5. Microscopic observations of the ablation behaviors of carbon fibre/phenolic composites;Cho;J. Mater. Sci. Lett.,1993
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