Highly thermal conductive epoxy composites enabled by 3D graphene/Cu-based dual networks for efficient thermal management
Author:
Funder
National Natural Science Foundation of China
Publisher
Elsevier BV
Reference28 articles.
1. Factors affecting thermal conductivities of the polymers and polymer composites: a review;Guo;Compos. Sci. Technol.,2020
2. Three-dimensional interconnected networks for thermally conductive polymer composites: design, preparation, properties, and mechanisms;Zhang;Mater. Sci. Eng. R Rep.,2020
3. Thermal conductivity of graphene-based polymer nanocomposites;Huang;Mater. Sci. Eng. R Rep.,2020
4. Liquid crystal epoxy resins with high intrinsic thermal conductivities and their composites: a mini-review;Ruan;Mater. Today Phys.,2021
5. Preparation of high thermal conductivity diamond/SiC composites with 3D connected diamond at low volume fraction;Liu;Compos. Commun.,2023
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