Study of the adsorptive behavior of Pd/PVP nanoparticles and its interaction with conditioner in electroless copper deposition-Reference-Cited by-同舟云学术

Study of the adsorptive behavior of Pd/PVP nanoparticles and its interaction with conditioner in electroless copper deposition

Published:2007-10 Issue:1-3 Volume:308 Page:93-99
ISSN:0927-7757
Container-title:Colloids and Surfaces A: Physicochemical and Engineering Aspects
language:en
Short-container-title:Colloids and Surfaces A: Physicochemical and Engineering Aspects

Author:

Peng Chao,Lo Sylvia H.Y.,Wan Chi-Chao,Wang Yung-Yun

Publisher

Elsevier BV

Subject

Colloid and Surface Chemistry

Reference17 articles.

1. Electroless (autocatalytic) plating;Henry;Met. Finish.,1971

2. G.O. Mallory, J.B. Hajdu, Electroless Plating: Fundamentals and Application, American Electroplaters and Surface Finishers Society, Orlando, Ch. 12, 1990.

3. Characterization of PdSn catalysts for electroless metal deposition;O'Sullivan;IBM J. Res. Develop.,1998

4. Palladium nanoparticles;Yang;Encyclo. Nanosci. Nanotechnol.,2004

5. C.R. Shipley, Method of electroless deposition on a substrate and catalyst solution therefore, US Patent No. 3,011,920 (1961).

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