Funder
National Natural Science Foundation of China
Fundamental Research Funds
Subject
Colloid and Surface Chemistry
Reference31 articles.
1. Tin–lead (SnPb) solder reaction in flip chip technology;Tu;Materials Science & Engineering R Reports,2001
2. Electrochemical migration characteristics of eutectic SnPb solder alloy in printed circuit board;Lee;Thin Solid Films,2006
3. The current status of lead-free solder alloys;Suraski;IEEE Transactions on Electronics Packaging Manufacturing,2001
4. Thermal fatigue and failure analysis of SnAgCu solder alloys with minor Pb additions;Collins;IEEE Transactions on Components and Packaging Technologies,2011
5. Recent advances of nanolead-free solder material for low processing temperature interconnect applications;Jiang;Microelectronics Reliability,2013
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献