Modeling of forces and material removal rate in ultrasound assisted magnetorheological polishing (UAMP) of sapphire
Author:
Funder
National Natural Science Foundation of China
Publisher
Elsevier BV
Subject
Colloid and Surface Chemistry
Reference45 articles.
1. Au nanoparticles prepared by physical method on Si and sapphire substrates for biosensor applications;Spadavecchia;J. Phys. Chem. B,2005
2. Optically transparent polycrystalline Al2O3 produced by spark plasmasintering;Jiang;J. Am. Ceram. Soc.,2008
3. Thermal healing of the sub-surface damage layer in sapphire;Pinkas;Mater. Chem. Phys.,2010
4. Analysis of interacting cracks due to sequential indentations on sapphire;Haney;Acta Mater.,2011
5. Modern trends in crystal growth and new applications of sapphire;Akselrod;J. Cryst. Growth,2012
Cited by 15 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Theoretical and experimental investigation on magnetorheological shear thickening polishing force using multi-pole coupling magnetic field;Journal of Materials Processing Technology;2024-07
2. Image processing–based material removal rate analysis of morphable polishing tools with labyrinth and dimple textures;The International Journal of Advanced Manufacturing Technology;2024-03-11
3. 熔石英元件磁性复合流体抛光去除特性研究;Infrared and Laser Engineering;2024
4. Modeling and simulation of material removal characteristics in magnetorheological shear thickening polishing;The International Journal of Advanced Manufacturing Technology;2023-08-05
5. Monodispersion of SiO2/CeO2 Binary Nano-Abrasives with Adjustable Size in Chemical Mechanical Polishing Performance of Copper;ECS Journal of Solid State Science and Technology;2023-07-01
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3