MXene-enhanced deep eutectic solvent-based flexible strain sensor with high conductivity and anti-freezing using electrohydrodynamic direct-writing method
Author:
Publisher
Elsevier BV
Subject
Colloid and Surface Chemistry
Reference45 articles.
1. Stretchable and tough conductive hydrogels for flexible pressure and strain sensors;Wang;J. Mater. Chem. B,2020
2. Stretchable, skin-mountable, and wearable strain sensors and their potential applications: a review;Amjadi;Adv. Funct. Mater.,2016
3. Flexible electronics and devices as human-machine interfaces for medical robotics;Heng;Adv. Mater.,2022
4. Development of an ultrastretchable double-network hydrogel for flexible strain sensors;Li;ACS Appl. Mater. Interfaces,2021
5. Flexible MXene-based composites for wearable devices;Ma;Adv. Funct. Mater.,2021
Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Water-induced reversible deformation materials: Synthesis and UV polymerization of sulfonic based polyacrylates;Colloids and Surfaces A: Physicochemical and Engineering Aspects;2024-11
2. Ultra‐high stretchability and wide temperature range adhesion hydrogels for flexible sensor;Journal of Applied Polymer Science;2024-09-05
3. Non-covalently crosslinked networks MXene-doped poly(eutectic) conductive elastomers with antimicrobial, self-healing, tunable mechanical properties, and wide temperature durability;Ceramics International;2024-09
4. Progress in etching-driven MXene synthesis and utilization in conductive inks for printed electronics applications: A comprehensive review;Synthetic Metals;2024-08
5. Non-covalent interactions in action: Advancing eutectogels for enhanced stability and performance;Polymer;2024-07
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3