High-temperature phase equilibria of Cu–O–MgO system in air
Author:
Publisher
Elsevier BV
Subject
Physical and Theoretical Chemistry,Condensed Matter Physics,Instrumentation
Reference21 articles.
1. Degradation mechanisms and use of refractory linings in copper production processes: a critical review;Malfliet;J. Eur. Ceram. Soc.,2014
2. Slag conditioning effects on MgO–C refractory corrosion performance;Luz;Ceram. Int.,2013
3. Equilibrium phase relationships in the system Cu–O under high oxygen pressure;Kosenko;J. Phase Equilib.,2001
4. Schmelzdiagramme höchstfeuerfester oxyde. V. Systeme mit MgO;von Wartenberg;Z. Anorg. Allgem. Chem.,1932
5. Soluzioni solide tra ossido di rame ed ossidi id metalli bivalenti. I sistemi CuO–NiO, CuO–MgO, e CuO–ZnO;Rigamonti;Atti. Accad. Naz. Lincei.,1947
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Integrated experimental and thermodynamic modeling study of phase equilibria in the ‘CuO0.5’-MgO-SiO2 system in equilibrium with liquid Cu metal for characterizing refractory-slag interactions;Ceramics International;2022-08
2. Corrosion Resistance of MgO and Cr2O3-Based Refractory Raw Materials to PbO-Rich Cu Slag Determined by Hot-Stage Microscopy and Pellet Corrosion Test;Materials;2022-01-18
3. Experimental determination of phase equilibria in the CaO‐BaO‐SiO 2 ‐12 mol pct. Al 2 O 3 ‐13 mol pct. MgO system at 1573 K and 1623 K;Journal of the American Ceramic Society;2019-03-21
4. Interactions of MgO·Al2O3 spinel with Cu, Cu2O and copper matte at high temperature;Ceramics International;2018-08
5. Phase relations in the Cu-O-Al2O3-SiO2 system at 1150 degrees C and 1300 degrees C in air;CALPHAD;2017
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3