Determination of melting and solidification temperatures of Sn-Ag-Cu solder spheres by infrared thermography
Author:
Funder
German Research Foundation
Publisher
Elsevier BV
Subject
Physical and Theoretical Chemistry,Condensed Matter Physics,Instrumentation
Reference28 articles.
1. Growth of Sn and intermetallic compounds in Sn-Ag-Cu solder;Lehman;J. Electron. Mater.,2004
2. Effects of cooling rate on the microstructure and tensile behavior of a Sn-3.5wt.%Ag solder;Ochoa;J. Electron. Mater.,2003
3. Effect of composition and cooling rate on the microstructure of SnAgCu-solder joints;Mueller,2007
4. Effect of sample size on the solidification temperature and microstructure of SnAgCu near eutectic alloys;Kinyanjui;J. Mater. Res.,2005
5. The effects of suppressed beta tin nucleation on the microstructural evolution of lead-free solder joints;Swenson;J. Mater. Sci. Mater. Electron.,2007
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