Effects of hot rolling on the microstructure, thermal and mechanical properties of CuAlBeNbNi shape memory alloy
Author:
Publisher
Elsevier BV
Subject
Physical and Theoretical Chemistry,Condensed Matter Physics,Instrumentation
Reference44 articles.
1. Grain size and pseudoelastic behaviour of a Cu–Al–Be alloy;Montecinos;Mater. Charact.,2008
2. Thermomechanical behavior of a CuAlBe shape memory alloy;Montecinos;J. Alloys Compd.,2008
3. Laser welding of Cu-Al-Be shape memory alloys: microstructure and mechanical properties;Oliveira;Mater. Des.,2018
4. Influence of Gd on the microstructure, mechanical and shape memory properties of Cu-Al-Be polycrystalline shape memory alloy;Guniputi;Mater. Sci. Eng. A,2018
5. Investigation on properties of shape memory alloy wire of Cu-Al-Be doped with zirconium;Singh;J. Mater. Eng. Perform.,2020
Cited by 16 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Rotary friction welding applied to Cu11.8Al0.45Be shape memory alloy;Journal of Advanced Joining Processes;2024-11
2. Cr-modified CuAlBe shape memory alloy: Role of microstructure, thermodynamic parameters, superelasticity, dissipated energy and corrosion resistance;Journal of Alloys and Metallurgical Systems;2024-09
3. Study of the stabilization of ordered austenite β1 in Cu79Al19X2 (X = Be or Mn) alloys;The European Physical Journal Plus;2024-06-22
4. Ultraslow calorimetric studies of the martensitic transformation of NiFeGa alloys: detection and analysis of avalanche phenomena;Journal of Thermal Analysis and Calorimetry;2024-05-19
5. Analysis of Chemical, Microstructural and Mechanical Properties of a CuAlBe Material Regarding Its Role as a Non-Sparking Material;Materials;2024-05-08
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3