Thermodynamic description of the Au–Ag–Pb ternary system
Author:
Publisher
Elsevier BV
Subject
Physical and Theoretical Chemistry,Condensed Matter Physics,Instrumentation
Reference36 articles.
1. Reaction characteristics of the Au-Sn solder with under-bump metallurgy layers in optoelectronic packages
2. Growth Behavior of Au–Sn and Ag–Sn Compounds during Solid-state Reactive Diffusion between Au–Ag Alloys and Sn
3. Application of Au-Sn eutectic bonding in hermetic radio-frequency microelectromechanical system wafer level packaging
4. Controlling the microstructure from the gold-tin reaction
5. Fluxless silicon-to-alumina bonding using electroplated Au–Sn–Au structure at eutectic composition
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1. Thermodynamic Modeling of the Au-Ge-X (X = In, Sb, Si, Zn) Ternary Systems;Materials;2024-05-02
2. Au-Pb compounds in nature: A general overview and new evidence from the Inagli Pt–Au placer deposit, the Aldan Shield, Russia;Ore Geology Reviews;2017-10
3. Thermodynamic modeling of the Au–Sb–Si ternary system;Journal of Alloys and Compounds;2011-02
4. Thermodynamic description of the Au–Ag–Ge ternary system;Thermochimica Acta;2011-01
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