Thermomechanical and viscoelastic behavior of a no-flow underfill material for flip-chip applications-Reference-Cited by-同舟云学术

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Thermomechanical and viscoelastic behavior of a no-flow underfill material for flip-chip applications

Published:2005-12 Issue:1-2 Volume:439 Page:127-134
ISSN:0040-6031
Container-title:Thermochimica Acta
language:en
Short-container-title:Thermochimica Acta

Author:

He Yi

Publisher

Elsevier BV

Subject

Physical and Theoretical Chemistry,Condensed Matter Physics,Instrumentation

Reference27 articles.

1. Solid logic technology: versatile, high-performance microelectronics;Davis;IBM J. Res. Dev.,1964

2. Flip Chip Technologies,1995

3. Reliability and stress analysis of encapsulated flip chip joint on epoxy based printed circuit packaging;Tsukada,1992

4. Encapsulation of flip-chip structure;Machuga,1992

5. Electronic Packaging and Interconnection Handbook,1997

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