Author:
Wang Fei,Li Xinxin,Cheng Rong,Jiang Kewei,Feng Songlin
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference14 articles.
1. SOP: what is it and why? A new microsystem-integration technology paradigm-Moore’s law for system integration of miniaturized convergent systems of the next decade;Tummala;IEEE Trans. Adv. Pack.,2004
2. A micromachined array probe card-fabrication process;Beiley;IEEE Trans. Comp., Pack. Manufact. Technol. B,1995
3. Thermally actuated microprobes for a new wafer probe card;Zhang;J. Microelectromech. Syst.,1999
4. K. Kataoka, T. Itoh, K. Inoue, T. Suga, Multi-layer electroplated micro-spring array for MEMS probe card, in: Proceedings of IEEE MEMS’04, Maastricht, Netherlands, 2004, pp. 733–736.
5. Cantilever-type microelectromechanical systems probe card with through-wafer interconnects for fine pitch and high-speed testing;Kim;Jpn. J. Appl. Phys.,2004
Cited by
16 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献