PMMA sacrificial layer based reliable debonding of ultra-thin chips after lapping-Reference-Cited by-同舟云学术

PMMA sacrificial layer based reliable debonding of ultra-thin chips after lapping

Published:2021-07 Issue: Volume:247 Page:111588
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Kumaresan Yogeenth,Ma Sihang,Dahiya Ravinder

Funder

Engineering and Physical Sciences Research Council

European Commission

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

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