Micro powder injection moulding-Reference-Cited by-同舟云学术

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Micro powder injection moulding

Published:2006-04 Issue:4-9 Volume:83 Page:1442-1444
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Zauner Rudolf

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference7 articles.

1. Injection Molding of Metals and Ceramics;German,1997

2. EU Report Market Analysis for Microsystems II 2000 – 2005, Nexus Grenoble, France, 2002.

3. EU Report Market Analysis for Microsystems I 1996 –2002, Network of Excellence in Multifunctional Microsystems, September 1998.

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