Properties of electroless Cu films optimized for horizontal plating as a function of deposit thickness-Reference-Cited by-同舟云学术

Properties of electroless Cu films optimized for horizontal plating as a function of deposit thickness

Published:2015-06 Issue: Volume:140 Page:38-46
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Sharma Tanu,Brüning Ralf,Nguyen Tang Cam Lai,Bernhard Tobias,Brüning Frank

Funder

Canada Foundation for Innovation

Atlantic Innovation Fund

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference31 articles.

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3. Autocatalysis during electroless copper deposition using glycoxylic aced as reducing agent;Yu;J. Electrochem. Soc.,2013

4. High density copper nucleation on ruthenium and its applications to direct plating of advanced interconnects;Shi;ECS Trans.,2013

5. Strain in electroless copper films monitored by x-ray diffraction during and after deposition and its dependence on bath chemistry;Brüning;Thin Solid Films,2011

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