A numerical method for calculating the dynamic stress in SAW devices-Reference-Cited by-同舟云学术

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A numerical method for calculating the dynamic stress in SAW devices

Published:2005-12 Issue:3-4 Volume:82 Page:670-674
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Kubat F.,Ruile W.,Rösler U.,Reindl L.M.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference9 articles.

1. U. Rösler, W. Ruile, K.Ch. Wagner, T.W. Johannes, G. Scholl, R. Weigel, in: IEEE Ultrason. Symp. Proc., 1996, pp. 1–4.

2. F. Kubat, W. Ruile, L. Reindl, in: IEEE Ultrason. Symp. Proc., 2002, pp. 317–320.

3. Y. Ebata, M. Koshino, O. Furukawa, in: IEEE Ultrason. Symp. Proc., 2000, pp. 5–7.

4. T. Kawakatsu, T. Okada, H. Ieki, in: IEICE Symp. Proc., 1990, pp. 55–60.

5. F. Kubat, W. Ruile, C. Eberl, T. Hesjedal, L. Reindl, to be published in Microelectron. Eng., 2005, in press.

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. The propagation of the multi-physical fields coupled Rayleigh wave on the half-space with a gradient piezoelectric semiconductor layer;Meccanica;2023-10-16

2. Texture-enhanced Al-Cu electrodes on ultrathin Ti buffer layers for high-power durable 2.6 GHz SAW filters;AIP Advances;2018-04

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