Author:
Wang Tong Hong,Chen Hsuan-Yu,Lee Chang-Chi,Lai Yi-Shao
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference9 articles.
1. Prismark Discovery Series, “Thermal interface materials: the conduit to cooler devices,” March 2009, pp. 1–23.
2. Arun Gowda, David Esler, and Sandeep Tonapi, “Voids in thermal interface material layers and their effect on thermal performance,” 2004, EPTC, pp. 41–46.
3. Clemens J.M. Lasance, Cameron T. Murray, David L. Saums and Marta Rencz, “Challenges in thermal interface material testing,” 22nd IEEE SEMI-THERM Symposium, 14–16 March 2006, pp. 42–49.
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