Passive on-chip components: Trends and challenges for RF applications-Reference-Cited by-同舟云学术

Passive on-chip components: Trends and challenges for RF applications

Published:2005-12 Issue:3-4 Volume:82 Page:503-513
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Decoutere S.,Carchon G.,Dehan M.,Mercha A.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference44 articles.

1. International Technology Roadmap for Semiconductors, 2003 ed., Radio Frequency and analog/Mixed-Signal Technologies for Wireless Communications.

2. D. Linten, S. Thijs, N. Mahadeva Iyer, P. Wambacq, W. Jeamsaksiri, J. Ramos, A. Mercha, S. Jenei. S. Donnay, S. Decoutere, Proceedings of the ESSCIRC, 2004, p. 291.

3. Analysis of current crowding effects in multiturn spiral inductors

4. Modeling spiral inductors in SOS processes

5. X. Sun, G. Carchon, W. De Raedt, Proceedings of the IEEE Radio Frequency Integrated Circuits Symposium, Fort Worth, TX, June 6–11, 2004, pp. 445–448.

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