Author:
Jacquemin J.-P.,Labonne E.,Yalicheff C.,Royet E.,Vannier P.,Delsol R.,Normandon P.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference4 articles.
1. Simulations of diffusion barrier deposition on porous low-k films
2. Properties and Barrier Material Interactions of Electroless Copper used for Seed Enhancement
3. D. Edelstein, C. Uzoh, C. Cabral, J.R.P. Dehaven, P. Buchwalter, A. Simon, E. Cooney, S. Malhotra, D. Klaus, H. Rathore, B. Aganvala, D. Nguyen, in: Interconnect Technology Conference, 2001, Proceedings of the IEEE 2001 International 4–6 June, 2001, pp. 9–11.
4. Failure Mechanism of Amorphous and Crystalline Ta-N Films in the Cu/Ta-N/Ta/SiO[sub 2] Structure
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