Study on the formation and mechanism of aluminum bulge defect in semiconductor integrated circuit manufacturing

Author:

Ji Liantao,Jian Chuanyong,Ma Qingcui,Liu Qingqing,Hua Yazhou

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference49 articles.

1. Core Circuit: a Book to Understand the Present and Future of Integrated Circuit Industry[M];Feng,2020

2. IC Manufacturing Process and Engineering Application[M];Wen,2018

3. The surface chemistry and kinetics of tungsten chemical vapor deposition and selectivity loss;Creighton;Thin Solid Films,1994

4. A review of LPCVD metallization for semiconductor devices;Cooke;Vacuum.,1985

5. 3D simulation of tungsten low-pressure chemical vapor deposition in contact holes;Bar;Appl. Surf. Sci.,1995

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