Author:
Halonen Eerik,Pynttäri Vesa,Lilja Juha,Sillanpää Hannu,Mäntysalo Matti,Heikkinen Jouko,Mäkinen Riku,Kaija Tero,Salonen Pekka
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference26 articles.
1. Inkjet Printing-Process and Its Applications
2. K. Kaija, Miniaturization of Electronics Utilizing Computational Modeling, Dissertation, Tampere University of Technology, Publication 755, 2008, 45 p.
3. J.J. Licari, Coating Materials for Electronic Applications; Polymers, Processes, Reliability, Testing. William Andrew Publishing, Inc., New York, 2003.
4. Corrosion protection of anisotropically conductive adhesive joined flip chips
5. S.-C. Park, Y.-B. Park, Jpn. J. Appl. Phys. 48(8 Part 2) (2009) 08HL021–08HL026.
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