Novel lamination and interconnection technologies demonstrated in a flexible modular optical sensor array for wound monitoring-Reference-Cited by-同舟云学术

Novel lamination and interconnection technologies demonstrated in a flexible modular optical sensor array for wound monitoring

Published:2010-05 Issue:5-8 Volume:87 Page:769-772
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

van den Brand Jeroen,Saalmink Milan,Barink Marco,Dietzel Andreas

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference6 articles.

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4. M.M. Koetse, P.A. Rensing, R.B.A. Sharpe, G.T. van Heck, B.A.M. Allard, N.N.M.M. Meulendijks, P.G.M. Kruijt, M.W.W.J. Tijdink, R.M.D. Zwart, R.J. Houben, E. Enting, S.J.J.F. van Veen, H.F.M. Schoo, An in-plane optical sensor, in: Proceedings of SPIE – The International Society for Optical Engineering, vol. 6739, 2007.

5. M.M. Koetse, P.A. Rensing, R.B.A. Sharpe, G.T. van Heck, B.A.M. Allard, N.N.M.M. Meulendijks, P.G.M. Kruijt, M.W.W.J. Tijdink, R.M. De Zwart, R.J. Houben, E. Enting, S.J.J.F. van Veen, H.F.M. Schoo, Optical sensor array platform based on polymer electronic devices, in: Electro-Optical Remote Sensing, Detection, and Photonic Technologies and Their Applications, Florence, Italy, 2007, p. 67391D-10.

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